Global ESD Packaging Market Size, Share, Trends, Growth by Product (Bags, Trays, Boxes & Containers, ESD foams, others), by end-users (Communication network infrastructure, Consumer electronics, Computer peripherals, Automotive industry, others), by Region (Asia-Pacific, North America, Europe, Row)
ESD Packaging Market Highlights
The ESD packaging is also called as antistatic packaging. Static can be caused by various factors such as including other devices, friction or even the weather. ESD Packaging is vital for the safe transportation and storage of most electronic products. Also, the operational requirement among original equipment manufacturers to isolate ESD sensitive items, components and devices during manufacturing, assembling and shipping has led to such specific packaging need catered by packaging manufacturers.
The global ESD Packaging market is expected to grow over the CAGR of around 8.2% during the period 2017 to 2023.
Request Sample Copy @ https://www.marketresearchfuture.com/sample_request/3211
The key players of the global ESD Packaging market are Teknis Limited (U.K.), Tandem Equipment Sales, Inc. (U.S.), Summit Packaging Solutions (U.S.), Stephen Gould Corp. (U.S.), Statico (U.S.), Elcom UK Ltd (U.K.), Protektive Pak (U.S.), GWP Group Limited (U.K.) and Desco Industries Inc. (U.S.).
Market Research Analysis
Asia-Pacific region is expected to dominate the ESD Packaging Market with the highest CAGR, owing to factors such as growing demand for smartphones and IT infrastructure. The developing economies such as China and India are the major contributors to the growth of the market in the region. In addition, government initiatives such as Digital India is expected to propel the usage of smartphones in the country, as a result boosting the growth of ESD Packaging market.
Raw Materials Suppliers
Research Institute / Education Institute
Key executive (CEO and COO) and strategy growth manager
Scope of the Report
This study provides an overview of the global ESD Packaging Market, tracking two market segments across four geographic regions. The report studies key players, providing a five-year annual trend analysis that highlights market size, volume and share for Asia-Pacific, North America, Europe and Rest of the World (ROW). The report also provides a forecast, focusing on the market opportunities for the next five years for each region. The scope of the study segments the global ESD Packaging market by its product, end-users and region.
- Boxes & Containers
- ESD foams
- Communication network infrastructure
- Consumer electronics
- Computer peripherals
- Automotive industry
- Asia Pacific
- North America
- Rest of World
Table Of Contents
1 Executive Summary
2 Research Methodology
2.1 Scope Of The Study
2.1.2 Research Objective
2.2 Research Process
2.2.1 Primary Research
2.2.2 Secondary Research
2.3 Market Size Estimation
2.4 Forecast Model
3 Market Dynamics
3.1 Market Drivers
3.2 Market Inhibitors
3.3 Supply/Value Chain Analysis
3.4 Porter’s Five Forces Analysis
Access Full Report With TOC @ https://www.marketresearchfuture.com/reports/electrostatic-discharge-packaging-market-3211
About Market Research Future
At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.
MRFR team have supreme objective to provide the optimum quality market research and intelligence services to our clients. Our market research studies by products, services, technologies, applications, end users, and market players for global, regional, and country level market segments, enable our clients to see more, know more, and do more, which help to answer all their most important questions.
Market Research Future
Phone: +1646 845 9312
Email: [email protected]