ESD Packaging Market Is Expected To Grow Over the CAGR Of 8.2% During Forecast 2023


Global ESD Packaging Market Size, Share, Trends, Growth by Product (Bags, Trays, Boxes & Containers, ESD foams, others), by end-users (Communication network infrastructure, Consumer electronics, Computer peripherals, Automotive industry, others), by Region (Asia-Pacific, North America, Europe, Row)

ESD Packaging Market Highlights

The ESD packaging is also called as antistatic packaging. Static can be caused by various factors such as including other devices, friction or even the weather. ESD Packaging is vital for the safe transportation and storage of most electronic products. Also, the operational requirement among original equipment manufacturers to isolate ESD sensitive items, components and devices during manufacturing, assembling and shipping has led to such specific packaging need catered by packaging manufacturers.

The global ESD Packaging market is expected to grow over the CAGR of around 8.2% during the period 2017 to 2023.

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Key Players

The key players of the global ESD Packaging market are Teknis Limited (U.K.), Tandem Equipment Sales, Inc. (U.S.), Summit Packaging Solutions (U.S.), Stephen Gould Corp. (U.S.), Statico (U.S.), Elcom UK Ltd (U.K.), Protektive Pak (U.S.), GWP Group Limited (U.K.) and Desco Industries Inc. (U.S.).

Market Research Analysis
Asia-Pacific region is expected to dominate the ESD Packaging Market with the highest CAGR, owing to factors such as growing demand for smartphones and IT infrastructure. The developing economies such as China and India are the major contributors to the growth of the market in the region. In addition, government initiatives such as Digital India is expected to propel the usage of smartphones in the country, as a result boosting the growth of ESD Packaging market. 

Target Audience


Raw Materials Suppliers

Aftermarket suppliers

Research Institute / Education Institute

Potential Investors

Key executive (CEO and COO) and strategy growth manager

Scope of the Report

This study provides an overview of the global ESD Packaging Market, tracking two market segments across four geographic regions. The report studies key players, providing a five-year annual trend analysis that highlights market size, volume and share for Asia-Pacific, North America, Europe and Rest of the World (ROW). The report also provides a forecast, focusing on the market opportunities for the next five years for each region. The scope of the study segments the global ESD Packaging market by its product, end-users and region.

By Product

  • Bags
  • Trays
  • Boxes & Containers
  • ESD foams
  • Others

By End-users

  • Communication network infrastructure
  • Consumer electronics
  • Computer peripherals
  • Automotive industry
  • Others

By Region

  • Asia Pacific
  • North America
  • Europe
  • Rest of World


Table Of Contents

1 Executive Summary

2 Research Methodology

2.1 Scope Of The Study

2.1.1 Definition

2.1.2 Research Objective

2.1.3 Assumptions

2.1.4 Limitations

2.2 Research Process

2.2.1 Primary Research

2.2.2 Secondary Research

2.3 Market Size Estimation

2.4 Forecast Model

3 Market Dynamics

3.1 Market Drivers

3.2 Market Inhibitors

3.3 Supply/Value Chain Analysis

3.4 Porter’s Five Forces Analysis


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